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INTEGRATED CIRCUITS
DATA SHEET
TDA8505 SECAM encoder
Preliminary specification Supersedes data of May 1993 File under Integrated Circuits, IC02 July 1994
Philips Semiconductors
Philips Semiconductors
Preliminary specification
SECAM encoder
FEATURES * Two input stages, R, G, B and Y, -(R-Y), -(B-Y) with multiplexing. * Chrominance processing, highly integrated, includes vertical identification, low frequency pre-emphasis and high frequency pre-emphasis (anti-Cloche) and bandpass filter. * Fully controlled FM modulator which produces a signal in accordance with the SECAM standard without adjustments. * Two reference oscillators, one for D'R f0 (4.40625 MHz) and one for D'B f0 (4.250 MHz). These oscillators are tuned by PLL loop with the frequency of the line sync as reference. Crystal tuning, or tuning by external reference source, of the reference oscillators is possible. * Output stages, CVBS and separated Y + SYNC and CHROMA. For CVBS output, signal amplitude 2 V (p-p) nominal, thus only an external emitter follower is required for 75 driving. * Sync separator circuit and pulse shaper, to generate the required pulses for the processing, line, frame, FH/2 and chrominance blanking. * A 3-level sandcastle pulse is generated for PAL/NTSC to SECAM transcoding. * FH/2 input for locking with another decoder. * Colour killing on the internal colour difference signals. * Internal bandgap reference. ORDERING INFORMATION PACKAGE TYPE NUMBER PINS TDA8505 32 PIN POSITION SDIP32 MATERIAL plastic GENERAL DESCRIPTION
TDA8505
The TDA8505 is a highly integrated SECAM encoding IC that is designed for use in all applications that require transformation of R, G and B signals or Y, U and V signals to a standard SECAM signal. The specification of the input signals is fully compatible with those of the TDA8501 PAL/NTSC encoder.
CODE SOT232-1
July 1994
2
handbook, full pagewidth
July 1994
2.2 k 1.2 k 100 nF 24 LPF 4.4 output 31 4.7 F SWITCH 26 PHASE DETECTOR 282 DIVIDER 4.406 MHz VCO
4.7 F
LPF4.25 output
22 nF
8
BLOCK DIAGRAM
10
Philips Semiconductors
VDDA 22 47 F nF V SSA VDDD XTAL/PLL VIDENT input
32
100 nF
SECAM encoder
V SSD PHASE DETECTOR 4.25 MHz VCO 270 pF VCO4.25 output 27 272 DIVIDER
30
composite sync input
22 nF
29
SYNC SEPARATOR
colour killing input 13 PULSE GENERATOR 1 nF PHASE DETECTOR 3.9 k 1 F LPFDR output 15
28
FH/2 input
4
external power supply (Vext )
19
sandcastle output
20
SANDCASTLE
TDA8505
ADDER 6.8 nF 100 470 nF PHASE DETECTOR
3
FRAME IDENTIFICATION LOW-PASS FILTER LF PREEMPHASIS CLAMP ADDER GAIN LIMITER FM MODULATOR PHASE SWITCH 2 k CLOCHE BANDPASS V ref 6 17 V ref TEST 1.8 k 47 F reference voltage output 22 nF 4.7 k 14 FADJ 22 nF FILTER CHROMINANCE BLANKING 16 220 nF FLT output 22 k 18 chrominance output ADDER CL/BL 5 47 nF luminance input 3 47 nF
control input (Y/Y SYNC)
12 LPFDB output Y+SYNC output 2 V (p-p) 25 650 DELAY ns LINE BUFFER 23 Y+SYNC input 22 notch output
multiplexer control input
2
7
RED input
CL/BL
47 nF
9
GREEN input
CL/BL
47 nF
MATRIX SWITCH SEQUENCE
11
Y+SYNC 1 V (p p)
BLUE input
CL/BL
47 nF
CL/BL
CL/BL
1
21 CVBS 2 V (p p) output
MLA951 - 3
47 nF
(R Y)
(B Y)
colour difference inputs
Preliminary specification
TDA8505
Fig.1 Block diagram.
Philips Semiconductors
Preliminary specification
SECAM encoder
TDA8505
PINNING D'R and D'B are the colour difference signals at the output of the multiplexer circuit; D'R = -1.9(R-Y) and D'B = +1.5(B-Y), for an EBU bar of 75% the amplitudes are equal. SYMBOL -(R-Y) MCONTR -(B-Y) FH/2 Y TEST R VDDA G VSSA B Y/Y+SYNC PIN 1 2 3 4 5 6 7 8 9 10 11 12 DESCRIPTION colour difference input signal, for EBU bar of 75% 1.05 V (peak-to-peak value) multiplexer control; input HIGH = RGB, input LOW = -(R-Y), -(B-Y) and Y colour difference input signal, for EBU bar of 75% 1.33 V (peak-to-peak value) line pulse input divided-by-2 for synchronizing two or more encoders; when not used this pin is connected to ground luminance input signal 1 V nominal without sync test pin; must be connected to VCC (pin 8), or left open-circuit RED input signal for EBU bar of 75% 0.7 V (peak-to-peak value) analog supply voltage for encoder part; 5 V nominal GREEN input signal for EBU bar of 75% 0.7 V (peak-to-peak value) analog ground BLUE input signal for EBU bar of 75% 0.7 V (peak-to-peak value) when this control input is LOW, Y without sync is connected to pin 5, input blanking at pin 5 is active; when input is HIGH, Y+SYNC is connected to pin 5, input blanking at pin 5 is not active modulator control loop filter output; black level of D'R = 4.40625 MHz adjustment pin for 4.286 MHz of HF pre-emphasis filter modulator control loop filter output; black level of D'B = 4.250 MHz filter tuning loop capacitor output 2.5 V internal reference voltage output chrominance output, amplitude corresponds with Y+SYNC at the output of the delay line external power supply for sandcastle generation; when not used this pin is connected to ground 3-level sandcastle output pulse composite SECAM output 2 V (peak-to-peak value) nominal Y+SYNC output after an internal resistor of 2 k; a notch filter can be connected Y+SYNC input, connected to the output of the delay line loop filter output for 4.40625 MHz reference oscillator Y+SYNC output, 2 V (peak-to-peak value) nominal, connected to the input of the delay line control pin; input HIGH = crystal tuning, input LOW = PLL tuning, both without vertical identification, 2.5 V = PLL tuning with vertical identification when used for PLL tuning a capacitor is connected; when used for crystal tuning a crystal has to be connected (in series with a capacitor) colour killing; input HIGH = active, internal colour difference signals are blanked composite sync input, 0.3 V (peak-to-peak value) nominal
LPFDR FADJ LPFDB FLT Vref CHROMA Vext SAND CVBS NOTCH Y+SYNC IN LPF4.4 Y+SYNC OUT XTAL/PLL VIDENT VCO4.25 COLKIL CS
13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29
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Philips Semiconductors
Preliminary specification
SECAM encoder
TDA8505
SYMBOL VSSD LPF4.25 VDDD
PIN 30 31 32 digital ground
DESCRIPTION loop filter output for 4.25 MHz reference oscillator; connected to pin 17 (Vref) when external tuning by crystal or signal source supply voltage for the digital part
handbook, halfpage
(R Y)
1 2 3 4 5 6 7 8
32 31 30 29 28 27 26 25
V DDD LPF4.25 V SSD CS COLKIL VCO4.25 XTAL/PLL VIDENT Y+SYNC OUT LPF4.4 Y+SYNC IN NOTCH
MCONTR (B Y) FH/2 Y TEST R VDDA G V SSA B Y/Y SYNC LPFDR FADJ LPFDB FLT
TDA8505
9 10 11 12 13 14 15 16
MLA952 - 3
24 23 22
21 CVBS 20 SAND 19 18 17 V ext CHROMA V ref
Fig.2 Pin configuration.
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Philips Semiconductors
Preliminary specification
SECAM encoder
FUNCTIONAL DESCRIPTION The following three important circuits are integrated: * Encoder circuit * Modulator control circuit * Sync separator and pulse shaper. Encoder circuit INPUT STAGE R, G and B inputs are connected to the matrix via a clamping and a blanking circuit. For an EBU colour bar of 75% the amplitude of the signal must be 0.7 V (peak-to-peak value). The outputs of the matrix are Y, D'R and D'B. The second part of the input stage contains inputs for colour difference signals and a luminance signal. The condition for 75% colour bar is -(R-Y) = 1.05 V (peak-to-peak value) at pin 1, -(B-Y) = 1.33 V (peak-to-peak value) at pin 3 and Y = 1 V (peak-to-peak value) without sync at pin 5. After clamping and blanking the amplitude and polarity are corrected such that the signals are equal to the signals of the matrix output. Signals are connected to a switch. Fast switching between the two input parts is possible by the multiplexer control pin (pin 2).
TDA8505
The Y output signal of the multiplexer is added to the sync pulse of the sync separator. The Y input (pin 5) is different to the other 5 inputs. The timing of the internal clamping is after the sync period and there is no vertical blanking. The input blanking of Y can be switched off by a HIGH at pin 12, and the internal sync separator signal is not added to the Y signal. In this way the Y+SYNC is allowed at pin 5 and after clamping internally connected directly to pin 25. The colour difference signals are switched sequentially by H/2 and fed to the low frequency pre-emphasis circuit. The colour-killing input signal at pin 28 can be used for completely blanking the internal colour difference signals at the input of the low frequency pre-emphasis filter. LOW FREQUENCY PRE-EMPHASIS This filter is fully integrated, Fig.3 illustrates the nominal response. The transfer is guaranteed within the illustrated area for the whole ambient temperature range by a compensation circuit.
handbook, full pagewidth
4
MLA953 - 1
H (dB) 2
0
2
4
6
8
10 10 4
10 5
10 6
f (Hz)
10 7
Fig.3 Nominal response for the low frequency pre-emphasis filter.
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Philips Semiconductors
Preliminary specification
SECAM encoder
VERTICAL IDENTIFICATION After the low frequency pre-emphasis the signal is clamped and, if desired the vertical identification sawtooth waveform can be added. The generation of the vertical identification is switched on/off by the logic level input at pin 26. Figure 4 shows the sawtooth waveform at the input of the FM modulator with the corresponding frequency values after modulation. Vertical identification is only possible if PLL tuning is selected. GAIN + LIMITER The gain of this amplifier is sequentially switched, so that the amplitude of D'R is 280/230 times the amplitude of D'B (based on an EBU colour bar). The signal is limited at a lower and upper level to ensure that the FM modulator frequencies are always between 3.9 MHz and 4.756 MHz. A DC offset between D'R and D'B is added which corresponds with the limiter levels. FM MODULATOR The signal of the gain + limiter stage is fed to the FM modulator. The modulator control adjusts the DC level at pin 13 to set the frequency of the FM signal to 4.406 MHz at the black
TDA8505
level of D'R. The modulator control also sets the DC level at pin 15 to adjust the FM frequency to 4.250 MHz at the black level of D'B. At the start of every line the FM modulator is stopped and is started again by a short duration pulse of the pulse shaper. These stop/start pulses are operating such that after two lines starting in the same phase, the start phase of the third line is shifted 180 degrees. This sequence is inverted during each vertical blanking. The FM signal is fed to the internal HF pre-emphasis filter. HF PRE-EMPHASIS AND BANDPASS FILTER An HF pre-emphasis filter combined with a bandpass filter is integrated. Figures 5 and 6 illustrate the frequency response. Two resistors in series with a potentiometer at pin 14 adjusts the frequency to 4.286 MHz with a tolerance of 20 kHz. A tuning circuit integrated with an external capacitor connected to pin 16 guarantees a stable frequency response for the whole temperature range. The output of the bandpass filter is connected directly to the chrominance blanking circuit.
handbook, full pagewidth
15 s 5 s
64 s
64 s
frequency after modulation 4.756 MHz 35 kHz
D'R
4.406 MHz
4.250 MHz
D'B
18 s 6 s
MLA954
3.90 MHz 35 kHz
Fig.4 Vertical identification sawtooth waveform input.
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Philips Semiconductors
Preliminary specification
SECAM encoder
TDA8505
MLA955 - 1
handbook, full pagewidth
0
H (dB) 20
40
60
80
100 10 5
10 6
10 7
f (Hz)
10 8
Fig.5 Frequency response of the HF pre-emphasis and bandpass filter; H as a function of frequency (1).
handbook, full pagewidth H
16
MLA956 - 1
(dB) 14 12 10 8 6 4 2 0 2 3.7 upper limit nominal lower limit
3.9
4.1
4.3
4.5
4.7 f (MHz)
4.9
Fig.6 Frequency response of the HF pre-emphasis and bandpass filter; H as a function of frequency (2).
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Philips Semiconductors
Preliminary specification
SECAM encoder
CHROMINANCE BLANKING The chrominance signal is blanked by the internally generated chrominance blanking pulse. The output of this blanking stage is connected to the chrominance and CVBS output circuits. Y+SYNC, CVBS, AND CHROMA OUTPUTS The Y output signal of the matrix is added to the composite sync signal of the sync separator. The output of this adder at pin 25 is connected to the input of an external delay line which is necessary for correct timing of the Y+SYNC signal corresponding with the chrominance signal. The signal amplitude at pin 25 is 2 V (peak-to-peak value) nominal, so at the output of the delay line Y+SYNC is 1 V (peak-to-peak value). The delay line has to be DC-coupled between pins 25 and 23 to ensure the required DC level at pin 23. The output resistor of the delay line has to be connected to pin 17 where (Vref = 2.5 V). The output of the delay line is connected to pin 23 which is the input of a buffer operational amplifier. The output of the buffer operational amplifier is connected to pin 22 and to the CVBS adder stage via an internal resistor of 2 k. An external notch filter can be connected to pin 22. The CVBS signal amplitude output at pin 21 is 2 V (peak-to-peak value) nominal. An external emitter follower is used to provide a 75 output load. The amplitude of the chrominance output signal which is connected to pin 18 corresponds with the Y+SYNC signal at the output of the delay line. Modulator control circuit The modulator control circuit has two tuning modes which are controlled by the input at pin 26: * Tuning by line frequency * Tuning by crystal or external signal source.
R int
handbook, halfpage
TDA8505
The outputs of the 272 divider are also used for pulse shaping. Within the vertical blanking period, another two Phase Locked Loops (PLLs) synchronizes the FM modulator during two lines with the 4.406 MHz reference VCO and during the following 2 lines with the 4.250 MHz reference VCO. The loop filters are connected to pins 13 and 15 respectively. It is necessary to use low-leakage capacitors for these loop filters. TUNING BY CRYSTAL OR EXTERNAL SIGNAL SOURCE When the frequency of the sync pulse at pin 29 is not stable or is incorrect it is possible to tune the FM modulator using an external 4.250 MHz crystal connected to pin 27. The 4.25 MHz loop at pin 31 has to be connected to pin 17 (Vref). A stable line frequency reference is generated by the 272 divider circuit which is used for the 4.406 MHz reference loop. An external signal source, instead of a crystal, can be connected at pin 27 via a capacitor in series with a resistor. The minimum AC current of 50 A is determined by the resistor values (Rint + Rext) and the output voltage of the signal source (see Fig.7). When crystal tuning is used no vertical identification is possible. Crystal tuning is recommended for VTR signals.
TDA8505
I OSCILLATOR 27 R ext 1 nF 50 A signal source V (p-p)
TUNING BY LINE FREQUENCY Two reference voltage controlled oscillators (VCOs) are integrated, the 4.4 MHz VCO with an internal capacitor and the 4.25 MHz VCO with an external capacitor at pin 27. A PLL loop with divider circuits directly couples the frequencies of the two VCOs with the line frequency of the sync separator sync signal. The loop filter for the 4.40625 MHz reference is at pin 24 and the loop filter for the 4.250 MHz reference is at pin 31. July 1994 9
800
MSA732 - 1
Fig.7 Tuning circuit for external signal source.
Philips Semiconductors
Preliminary specification
SECAM encoder
Sync separator and pulse shaper The composite sync input at pin 29 together with the outputs of the 272 divider of the 4.250 MHz reference loop are the sources for all pulses necessary for the processing. The pulses are used for: * Clamping * Video blanking * FH/2 * Chrominance blanking * Stop/start of modulator * Vertical identification * Timing for the modulator control * Sandcastle pulse shaping at pin 20. External FH/2 at pin 4 is only necessary when two or more SECAM encoders have to be locked in the same phase. The phase of the internal FH/2 can be locked with an external FH/2 connected at pin 4. A reset of the internal FH/2 is possible by forcing pin 4 to a HIGH level. This HIGH level corresponds with D'R. Pin 4 is connected to ground when not used.
TDA8505
Figures 9 and 10 show the generated pulses during vertical blanking for PLL tuning or crystal tuning respectively. Figure 11 shows the pulses during line blanking. Transcoding application A sandcastle pulse is necessary for the PAL/NTSC demodulator (i.e. TDA4510) for transcoding PAL or NTSC to SECAM. Most of the demodulator ICs use a sandcastle pulse with an amplitude of 12 V or 8 V. A 12 V or 8 V sandcastle is not possible with the TDA8505 because of the 5 V power supply. To generate a 3-level sandcastle pulse at pin 20 (see Fig.8) an external supply voltage must be connected to pin 19. The PAL or NTSC CVBS signal is connected to the composite sync input (pin 29) for PLL tuning and pulse shaping. As previously mentioned the Y input at pin 5 can be used as the Y+SYNC input for the filtered Y+SYNC PAL or NTSC signal, when pin 12 is at a HIGH level.
handbook, full pagewidth
V ext
4.5 V 2.5 V
0.2 V 0.2 V
MSA733 - 1
0.5 V
Fig.8 3-level sandcastle pulse.
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FIELD 1
625 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
FIELD 2
622
623
624
Philips Semiconductors
SECAM encoder
310
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337
11 Preliminary specification
TDA8505
Fig.9 PLL tuning.
July 1994
FIELD 1
625 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 624
FIELD 2
622
623
Philips Semiconductors
SECAM encoder
310
311
312
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12 Preliminary specification
TDA8505
Fig.10 Crystal tuning.
Philips Semiconductors
Preliminary specification
SECAM encoder
TDA8505
Fig.11 Pulses during line blanking.
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Philips Semiconductors
Preliminary specification
SECAM encoder
TDA8505
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); all voltages referenced to VSSA pin 10. SYMBOL VDDA VDDD Vext Tstg Tamb digital supply voltage external supply voltage for sandcastle generation storage temperature operating ambient temperature PARAMETER analog supply voltage for encoder part 0 0 0 -65 -25 MIN. MAX. 5.5 5.5 13.2 +150 +70 V V V C C UNIT
THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient in free air VALUE 60 UNIT K/W
DC CHARACTERISTICS VCC and VDD = 5 V; Tamb = 25 C; all voltages referenced to pins 10 and 30; unless otherwise specified. SYMBOL VDDA VDDD IDDA IDDD Vext Ptot Vref PARAMETER analog supply voltage for encoder part (pin 8) digital supply voltage (pin 32) analog supply current digital supply current external supply voltage for sandcastle generation total power dissipation reference voltage output (pin 17) MIN. 4.5 4.5 - - 0 - 2.425 TYP. 5.0 5.0 39 4 8 to 12 215 2.5 MAX. 5.5 5.5 - - 13.2 - 2.575 V V mA mA V mW V UNIT
AC CHARACTERISTICS VCC and VDD = 5 V; Tamb = 25 C; composite sync signal connected to pin 29; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. - - - V17 80 80 TYP. - - 1 - - - MAX. UNIT
Encoder circuit: input stage (pins 1, 3, 5, 7, 9 and 11; black level = clamping level Vn(max) Vn(min) Ibias(max) VI ZI voltage from black level positive voltage from black level negative maximum input bias current input voltage clamped input clamping impedance only pins 1, 3 and 5 VI = V17 input capacitor connected to ground II = 1 mA IO = 1 mA 1.2 0.9 - - - - V V A V
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Philips Semiconductors
Preliminary specification
SECAM encoder
TDA8505
SYMBOL
PARAMETER LOW level input voltage Y, -(R-Y) and -(B-Y) HIGH level input voltage R, G and B input current switching time
CONDITIONS
MIN. - - -
TYP.
MAX.
UNIT
Multiplexer control (pin 2; note 1) VIL VIH II tsw VIL VIH 0 1 - - 0.4 5 -3 - V V A ns
50 - -
Control input Y/Y+SYNC (pin 12) LOW level input voltage HIGH level input voltage blanking pin 5 active; internal sync added to Y blanking pin 5 inactive; internal sync not added to Y 0 4 1 5 V V
II(max) VIL VIH VI
maximum input current
-
- - - V17
1
A
XTAL/PLL and VIDENT input (pin 26) LOW level input voltage HIGH level input voltage input voltage PLL mode; vertical identification off crystal tuning; vertical identification off pin 26 connected to pin 17; PLL tuning; vertical identification on; see Fig.4 0 4 - 1 5 - V V V
II VIL VIH II(max) VIL VIH II(max)
input current
-
- - - - - - -
-6
A
COLKIL input (pin 28) LOW level input voltage HIGH level input voltage maximum input current inactive active 0 4 - 1 5 1 V V A
FH/2 input (pin 4) LOW level input voltage HIGH level input voltage maximum input current inactive active 0 4 - 1 5 1 V V A
LF pre-emphasis (see Fig.3) HF pre-emphasis and bandpass (see Figs 5 and 6) FADJ input (pin 14) resistor value for correct adjustment; see Fig.1 input sensitivity II(max) maximum input current - - 1.75 - - 100 kHz/mV nA
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Philips Semiconductors
Preliminary specification
SECAM encoder
TDA8505
SYMBOL FLT output (pin 16) VDCL VDCH VDC RO Isink(max) Isource(max) VBL VSYNC VY B td td td Ibias VI(max) RO VDC Isink(max) Isink(max) Isource(max) VDC VDC
PARAMETER
CONDITIONS IO = 200 A II = 200 A - -
MIN.
TYP. - -
MAX.
UNIT
limited DC LOW level output voltage limited DC HIGH level output voltage DC level output voltage
0.27 1.8 0.86 - - - 1.6 600 1400 - - 290 10 - -
V V V A mA V mV mV MHz ns ns ns A V V A A mA V mV mV mV mV
tbf - 200 1 - 570 1330 RL = 10 k; CL = 10 pF RL = 10 k; CL = 10 pF 10 - 220 - - -
tbf
Y+SYNC output (pin 25) output resistance maximum sink current maximum source current black level output voltage sync voltage amplitude Y voltage amplitude bandwidth frequency response group delay time tolerance sync delay time from pin 29 to pin 25 Y delay time from pin 5 to pin 25 40 - - - 630 1470 - 20 360 -
Y+SYNC input (pin 23; note 2) input bias current maximum Y voltage amplitude 1 1
NOTCH output (pin 22) output resistance DC output voltage level maximum sink current 1750 - 300 2000 V23 - - - 2.5 5 5 120 165 205 2250 - - - - - - - - - -
CHROMA output (pin 18) maximum sink current maximum source current DC voltage level variation of DC voltage level chrominance signal blanked chrominance signal not blanked RO VO(p-p) output resistance chrominance output voltage amplitude (peak-to-peak value) f = 4.25 MHz f = 4.406 MHz 200 1 - - - - - -
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Philips Semiconductors
Preliminary specification
SECAM encoder
TDA8505
SYMBOL
PARAMETER
CONDITIONS - -
MIN.
TYP. - -
MAX.
UNIT
FREQUENCY OF CHROMINANCE SIGNAL (NOTE 3) fOR fOB fmax fmin D'R D'B black level of D'R black level of D'B maximum frequency minimum frequency deviation of D'R deviation of D'B EBU bar of 75% EBU bar of 75% 4406 4250 4756 3900 280 230 - - 1.6 6 6 120 kHz kHz kHz kHz kHz kHz A mA V dB dB
4721 3865 252 207
4791 3935 308 253 - - - - - -
CVBS output (pin 21) Isink(max) Isource(max) Vblack GY GCHR RO VO ILO VO ILO VO ILO maximum sink current maximum source current black level voltage gain Y+SYNC (pin 23 to pin 21) gain CHROMA (pin 18 to pin 21) output resistance 250 1 - - - -
LPFDR output (pin 13) DC control voltage level control sensitivity output leakage current LPFDB output (pin 15) DC control voltage level control sensitivity output leakage current LPF4.4 output (pin 24) DC control voltage level control sensitivity output leakage current LPF4.25 output (pin 31; Cext = 270 pF) VO ILO DC control voltage level control sensitivity output leakage current VCO4.25 (pin 27; note 4) CS input (pin 29) VI(p-p) sync pulse input amplitude (peak-to-peak value) slicing level II IO(max) input current maximum output current during sync 75 - - - 300 50 4 100 600 - - - mV % A A tbf - - 2.3 5.3 - tbf - 100 V kHz/mV nA tbf - - 2.3 1.5 - tbf - 100 V kHz/mV nA tbf - - 2.1 1.5 - tbf - 50 V kHz/mV nA tbf - - 2.4 0.2 - tbf - 50 V kHz/mV nA
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Philips Semiconductors
Preliminary specification
SECAM encoder
TDA8505
SYMBOL Vext (pin 19) Iext
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
external supply current
-
- - -
1.5 - - - -
mA A A V V
SAND output (pin 20; Vext = 13.2 V); see Fig.8 Isink(max) Isource(max) VTL maximum sink current maximum source current top voltage level Vext < 10 V Vext > 10 V Notes 1. The threshold level of pin 2 is 700 20 mV. The specification of the HIGH and LOW levels is in accordance with the scart fast blanking. 2. The black level of input signal must be 2 V; amplitude 1 V (peak-to-peak value) nominal (Y = 700 mV, SYNC = 300 mV). 3. The tolerances of fOR and fOB are with the printed-circuit board <5 kHz. This value can be influenced by the print layout. 4. The oscillator operates in series-resonance. The resonance resistance of the crystal must be <60 and parallel capacitance of the crystal <10 pF. INTERNAL CIRCUITRY PIN 1 NAME -(R-Y) CIRCUIT DESCRIPTION -(R-Y) input; connected via 47 nF capacitor; 1.05 V (peak-to-peak value) for EBU bar of 75%; see also pins 3, 5, 7, 9 and 11 100 100
Vext - 0. - 1 10 -
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Philips Semiconductors
Preliminary specification
SECAM encoder
TDA8505
PIN 2
NAME MCONTR
CIRCUIT
DESCRIPTION multiplexer control input: <0.4 V Y, U and V >1 V R, G and B
3
-(B-Y)
see pin 1
4
FH/2
5
Y
see pin 1
6
TEST
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19
B
-(B-Y) input; connected via 47 nF capacitor; 1.33 V (peak-to-peak value) for EBU bar of 75% FH/2 input; forcing possibility; when not used this pin is connected to ground Y input; connected via 47 nF capacitor; 1 V (peak-to-peak value) for EBU bar of 75% test pin; connected to VCC or left open-circuit
Philips Semiconductors
Preliminary specification
SECAM encoder
TDA8505
PIN 7 R
NAME see pin 1
CIRCUIT
DESCRIPTION RED input; connected via 47 nF capacitor; 0.7 V (peak-to-peak value) for EBU bar of 75% analog supply voltage for encoder part; 5 V nominal
8
VDDA
9
G
see pin 1
GREEN input; connected via 47 nF capacitor; 0.7 V (peak-to-peak value) for EBU bar of 75% analog ground
10
VSSA
11
B
see pin 1
BLUE input; connected via 47 nF capacitor; 0.7 V (peak-to-peak value) for EBU bar of 75% control pin: 0 V Y without sync supplied to pin 5 5 V Y with sync supplied to pin 5
12
Y/Y+SYNC
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Philips Semiconductors
Preliminary specification
SECAM encoder
TDA8505
PIN 13
NAME LPFDR
CIRCUIT
DESCRIPTION modulator control loop filter with low leakage capacitors
14
FADJ
adjustment pin for 4.286 MHz: potentiometer in series with two resistors between ground and pin 17
15 16
LPFDB FLT
see pin 13
modulator control loop filter with low leakage capacitors filter control pin; 220 nF capacitor to ground
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B B
Philips Semiconductors
Preliminary specification
SECAM encoder
TDA8505
PIN 17 Vref
NAME
CIRCUIT
DESCRIPTION 2.5 V reference voltage decoupling with 47 F and 22 nF capacitors
18
CHROMA
chrominance output
19
Vext
pin for external power supply, for sandcastle pulse; Vext > 8 V; if not used, the pin should be connected to ground
20
SAND
sandcastle pulse
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Philips Semiconductors
Preliminary specification
SECAM encoder
TDA8505
PIN 21
NAME CVBS
CIRCUIT
DESCRIPTION composite SECAM output
22
NOTCH
pin for external notch filter
23
Y+SYNC IN
input of the delayed Y+SYNC signal of the delay line; black level must be 2 V
24
LPF4.4
see pin 13
loop filter for 4.40625 MHz reference oscillator
July 1994
23
Philips Semiconductors
Preliminary specification
SECAM encoder
TDA8505
PIN 25
NAME Y+SYNC OUT
CIRCUIT
DESCRIPTION output of the delayed Y+SYNC signal, connected to the delay line via a resistor
26
XTAL/PLL VIDENT
control pin: without vertical identification: 0 V PLL tuning
27
VCO4.25
July 1994
24
B B B
B B B B B
5 V crystal tuning with vertical identification: 2.5 V PLL tuning
tuning of 4.25 MHz oscillator: PLL tuning: C = 270 pF to ground crystal tuning: crystal in series with a capacitor to ground external tuning: signal via 1 nF capacitor in series with a resistor
Philips Semiconductors
Preliminary specification
SECAM encoder
TDA8505
PIN 28
NAME COLKIL
CIRCUIT
DESCRIPTION colour killing input: 0 V not active 5 V active, internal D'R and D'B are blanked
29
CS
composite sync signal input; amplitude <600 mV (peak-to-peak value)
30
VSSD
digital ground
July 1994
25
B B B B
B B B B
Philips Semiconductors
Preliminary specification
SECAM encoder
TDA8505
PIN 31
NAME LPF4.25
CIRCUIT
DESCRIPTION loop filter for 4.25 MHz reference oscillator; connected to pin 17 if crystal or external tuning
32
VDDD
supply voltage digital part; 5 V nominal
July 1994
26
Philips Semiconductors
Preliminary specification
SECAM encoder
PACKAGE OUTLINE
TDA8505
seating plane
29.4 28.5 3.8 max 4.7 max
10.7 10.2
3.2 2.8
0.51 min 0.18 M
1.6 max
1.778 (15x) 1.3 max
0.53 max
0.32 max 10.16 12.2 10.5
MSA270
32
17 9.1 8.7
1
16
Dimensions in mm.
Fig.12 Plastic shrink dual in-line package; 32 leads (400 mil) (SDIP32; SOT232-1).
July 1994
27
Philips Semiconductors
Preliminary specification
SECAM encoder
SOLDERING Plastic dual in-line packages BY DIP OR WAVE The maximum permissible temperature of the solder is 260 C; this temperature must not be in contact with the joint for more than 5 s. The total contact time of successive solder waves must not exceed 5 s. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8505
specified storage maximum. If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron below the seating plane (or not more than 2 mm above it). If its temperature is below 300 C, it must not be in contact for more than 10 s; if between 300 and 400 C, for not more than 5 s.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
July 1994
28
Philips Semiconductors
Preliminary specification
SECAM encoder
NOTES
TDA8505
July 1994
29
Philips Semiconductors
Preliminary specification
SECAM encoder
NOTES
TDA8505
July 1994
30
Philips Semiconductors
Preliminary specification
SECAM encoder
NOTES
TDA8505
July 1994
31
Philips Semiconductors - a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367 Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. (02)805 4455, Fax. (02)805 4466 Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213, Tel. (01)60 101-1236, Fax. (01)60 101-1211 Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands, Tel. (31)40 783 749, Fax. (31)40 788 399 Brazil: Rua do Rocio 220 - 5th floor, Suite 51, CEP: 04552-903-SAO PAULO-SP, Brazil. P.O. Box 7383 (01064-970). Tel. (011)821-2333, Fax. (011)829-1849 Canada: INTEGRATED CIRCUITS: Tel. (800)234-7381, Fax. (708)296-8556 DISCRETE SEMICONDUCTORS: 601 Milner Ave, SCARBOROUGH, ONTARIO, M1B 1M8, Tel. (0416)292 5161 ext. 2336, Fax. (0416)292 4477 Chile: Av. Santa Maria 0760, SANTIAGO, Tel. (02)773 816, Fax. (02)777 6730 Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17, 77621 BOGOTA, Tel. (571)249 7624/(571)217 4609, Fax. (571)217 4549 Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. (032)88 2636, Fax. (031)57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. (9)0-50261, Fax. (9)0-520971 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. (01)4099 6161, Fax. (01)4099 6427 Germany: PHILIPS COMPONENTS UB der Philips G.m.b.H., P.O. Box 10 63 23, 20043 HAMBURG, Tel. (040)3296-0, Fax. (040)3296 213. Greece: No. 15, 25th March Street, GR 17778 TAVROS, Tel. (01)4894 339/4894 911, Fax. (01)4814 240 Hong Kong: PHILIPS HONG KONG Ltd., Components Div., 6/F Philips Ind. Bldg., 24-28 Kung Yip St., KWAI CHUNG, N.T., Tel. (852)424 5121, Fax. (852)428 6729 India: Philips INDIA Ltd, Components Dept, Shivsagar Estate, A Block , Dr. Annie Besant Rd. Worli, Bombay 400 018 Tel. (022)4938 541, Fax. (022)4938 722 Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4, P.O. Box 4252, JAKARTA 12950, Tel. (021)5201 122, Fax. (021)5205 189 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. (01)640 000, Fax. (01)640 200 Italy: PHILIPS COMPONENTS S.r.l., Viale F. Testi, 327, 20162 MILANO, Tel. (02)6752.3302, Fax. (02)6752 3300. Japan: Philips Bldg 13-37, Kohnan 2 -chome, Minato-ku, TOKYO 108, Tel. (03)3740 5028, Fax. (03)3740 0580 Korea: (Republic of) Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. (02)794-5011, Fax. (02)798-8022 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880 Mexico: Philips Components, 5900 Gateway East, Suite 200, EL PASO, TX 79905, Tel. 9-5(800)234-7381, Fax. (708)296-8556 Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB Tel. (040)783749, Fax. (040)788399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. (09)849-4160, Fax. (09)849-7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. (022)74 8000, Fax. (022)74 8341 Pakistan: Philips Electrical Industries of Pakistan Ltd., Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton, KARACHI 75600, Tel. (021)587 4641-49, Fax. (021)577035/5874546. Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc, 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. (02)810 0161, Fax. (02)817 3474 Portugal: PHILIPS PORTUGUESA, S.A., Rua dr. Antonio Loureiro Borges 5, Arquiparque - Miraflores, Apartado 300, 2795 LINDA-A-VELHA, Tel. (01)14163160/4163333, Fax. (01)14163174/4163366. Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. (65)350 2000, Fax. (65)251 6500 South Africa: S.A. PHILIPS Pty Ltd., Components Division, 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. (011)470-5911, Fax. (011)470-5494. Spain: Balmes 22, 08007 BARCELONA, Tel. (03)301 6312, Fax. (03)301 42 43 Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM, Tel. (0)8-632 2000, Fax. (0)8-632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. (01)488 2211, Fax. (01)481 77 30 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978, TAIPEI 100, Tel. (02)388 7666, Fax. (02)382 4382. Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, Bangkok 10260, THAILAND, Tel. (662)398-0141, Fax. (662)398-3319. Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. (0 212)279 2770, Fax. (0212)269 3094 United Kingdom: Philips Semiconductors Limited, P.O. Box 65, Philips House, Torrington Place, LONDON, WC1E 7HD, Tel. (071)436 41 44, Fax. (071)323 03 42 United States: INTEGRATED CIRCUITS: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556 DISCRETE SEMICONDUCTORS: 2001 West Blue Heron Blvd., P.O. Box 10330, RIVIERA BEACH, FLORIDA 33404, Tel. (800)447-3762 and (407)881-3200, Fax. (407)881-3300 Uruguay: Coronel Mora 433, MONTEVIDEO, Tel. (02)70-4044, Fax. (02)92 0601
For all other countries apply to: Philips Semiconductors, International Marketing and Sales, Building BAF-1, P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-724825 SCD32 (c) Philips Electronics N.V. 1994
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
533061/1500/03/pp32 Document order number: Date of release: July 1994 9397 736 70011
Philips Semiconductors

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